Debonding-Type Variable Adhesive > PRODUCTS

Debonding type variable adhesive

Debonding-Type Variable Adhesive

Debonding type variable adhesive

Maintain strong adhesion during the process,

If necessary, it can be removed cleanly Next Generation Variable Adhesion Solutions

Precision Temporary Bonding Technology

for precision processing

Stable temporary bonding technology

in semiconductor and advanced packaging processes It maintains high fixation during processing,

After the process is completed

Designed to minimize substrate damage and residue. In addition, UV trigger-based adhesion control

Stable processability even in precision manufacturing process Clean debonding performance

We offer it at the same time.

Adhesion Switching

Adhesive Switching Mechanism

It maintains stable steel adhesion during precise processing,

Quick decrease of adhesion after trigger activation

It minimizes residues and implements stable peeling.

Mechanism

Variable Adhesion Mechanism

Under certain trigger conditions, the adhesive structure changes

Maintain strong adhesion during the process,

After that, it is designed for stable peeling.

in the process
Maintaining strong holding force
throughout the precision manufacturing process
Staying Stable Adhesive
Based on UV triggers
Decreased adhesion
Due to changes in the adhesive network during UV irradiation Adjustable adhesion
clean peeling / low residue
by minimizing the occurrence of residues
Improve post-process quality
PET / PI Substrate
Applicable
Various films such as PET, PI, and
Applicable to substrate processing

Target Applications

Key Applications

requiring precise temporary adhesion and stable peeling

It is an optimized solution for advanced manufacturing processes.

Glass core substrate

In glass-based substrate process

Stable temporary adhesion and

Provides protection performance

Chiplet Integration Process

Chiplet assembly and

In the high-precision packaging process

Reliable process support

FOWLP process

Fan-Out Wafer Level

Packaging

in the process

Provides precision bonding and debonding performance

Temporary Adhesive Carrier Process

Based on carrier film

in the manufacturing process

Stable

Provisional adhesion and clean peeling support

ceo@l-materials.com, 070-8064-8707,

Room 508, Tecno 1-ro, Yuseong-gu, Daejeon